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1. general description the tfa9882 is a mono, filter-free class-d audio amplifier in a 9-bump wlcsp (wafer level chip-size package) with a 400 m pitch. it receives audio and control settings via an i 2 s digital interface. the power-down to operating mode transition is triggered when a clock signal is detected on the bit clock input (bck). two devices can be combined to build a stereo application. in stereo applications, the left or right i 2 s audio stream is selected by connecting the word select signal to, respectively, pin wsl or pin wsr. mono mixing can be achieved by connecting the word select si gnal to both wsl and wsr. switching off the word select signal selects mute mode. the device features low rf su sceptibility because it has a digi tal input interface that is insensitive to clock jitter. the second order closed loop architecture used in the tfa9882 provides excellent audio performance and high supply voltage ripple rejection. 2. features and benefits ? small outline wlcsp9 package: 1.27 1.49 0.6 mm ? wide supply voltage range (fully operational from 2.5 v to 5.5 v) ? high efficiency (90 %, 4 /20 h load) and low power dissipation ? quiescent power: ? 6.5 mw (v ddd = 1.8 v, v ddp = 3.6 v, 4 /20 h load, f s =32 khz) ? 7.65 mw (v ddd =1.8 v, v ddp = 3.6 v, 4 /20 h load, f s = 48 khz) ? output power: ? 1.4 w into 4 at 3.6 v supply (thd = 1 %) ? 2.7 w into 4 at 5.0 v supply (thd = 1 %) ? 3.4 w into 4 at 5.0 v supply (thd = 10 %) ? output noise voltage: 24 v (a-weighted) ? signal-to-noise ratio: 103 db (v ddp = 5 v, a-weighted) ? fully short-circuit proof across load and to supply lines ? current limiting to avoid audio holes ? thermally protected ? undervoltage and overvoltage protection ? high-pass filter for dc blocking ? simplified interface for audio and control settings ? left/right selection and mono mixing ? three gain settings: ? 3db, 0db and +3db tfa9882 3.4 w i2s input mono cl ass-d audio amplifier rev. 2 ? 20 april 2011 product data sheet
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 2 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier ? output slope setting for emi reduction ? clip control for smooth clipping ? mute mode ? low rf susceptibility ? insensitive to input clock jitter ? ?pop noise' free at all mode transitions ? short power-up time: 4 ms ? short power-down time: 5 s ? 1.8 v/3.3 v tolerant digital inputs ? only two external components required 3. applications ? pdas ? mobile phones ? portable gaming devices ? portable navigation devices (pnd) ? notebooks/netbooks ? portable media players 4. quick reference data [1] r l = load resistance; l l = load inductance. table 1. quick reference data all parameters are guaranteed for v ddp = 3.6 v; v ddd = 1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v ddp power supply voltage on pin v ddp 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i ddp power supply current operating mode with load - 1.5 1.7 ma mute mode - 1.1 1.25 ma power-down mode - 0.1 1 a i ddd digital supply current operating mode - 1.25 1.4 ma mute mode - 1.1 1.2 ma power-down mode bck = ws = data = 0 v -2.510 a p o(rms) rms output power thd + n = 1 % v ddp = 3.6 v, f i = 100 hz - 1.4 - w v ddp = 5.0 v, f i = 100 hz - 2.7 - w thd + n = 10 % v ddp = 3.6 v, f i = 100 hz - 1.75 - w v ddp = 5.0 v, f i = 100 hz - 3.4 - w po output power efficiency p o(rms) =1.4 w - 90 - %
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 3 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 5. ordering information 6. block diagram table 2. ordering information type number package name description version TFA9882UK wlcsp9 wafer level chip-size package; 9 bumps; body 1.49 1.27 mm TFA9882UK fig 1. block diagram of the tfa9882 010aaa724 outa outb power down control h-bridge pwm c3 a3 hp filter i 2 s receiver wsl bck a2 c1 a1 data mute control left/right selection v ddd v ddp tfa9882 protection circuits: otp ovp uvp ocp gnd b1 b2 b3 c2 wsr
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 4 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 7. pinning information 7.1 pinning 7.2 pin description fig 2. bump configuration for wlcsp9 (bottom view) fig 3. bump configuration for wlcsp9 (top view) 123 010aaa725 tfa9882 bottom view bump a1 index area c b a a b c 123 010aaa726 tfa9882 transparent top view bump a1 index area fig 4. bump mapping for wlcsp9 data wsl outb 123 v ddd v ddp gnd a b bck wsr outa c 010aaa727 transparent top view table 3. pin description symbol pin type description data a1 i data input wsl a2 i word select input left channel; connect to v ddp or pcb ground if right channel is selected outb a3 o inverting output v ddd b1 p digital supply voltage (1.8 v) v ddp b2 p power supply voltage (2.5 v to 5.5 v) gnd b3 p ground reference bck c1 i bit clock input wsr c2 i word select input right channel; connect to v ddp or pcb ground if left channel is selected outa c3 o non-inverting output
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 5 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 8. functional description the tfa9882 is a high-efficiency mono bridge tied load (btl) class-d audio amplifier with a digital stereo i 2 s input interface. a high-pass (hp) filter removes the dc components from the incoming i 2 s stream. this stream is subsequently converted into two pulse width modulated (pwm) signals. a 3-level pwm scheme supports filterless speaker drive. 8.1 mode selection and interfacing the tfa9882 supports four operating modes: ? power-down mode , with low supply current ? mute mode , in which the output stages are floating so that the audio input signal is suppressed ? operating mode , in which the amplifier is fully operational, de livering an output signal ? fault mode the tfa9882 switches to fault mode auto matically when a protection mechanism is activated (see section 8.8 ). the defined patterns required on the bck, wsl and wsr inputs to select the other three modes are given in ta b l e 4 . power-down mode is selected when there is no bit clock signal on the bck input. applying the bit clock signal will cause the tf a9882 to switch from power-down mode to operating mode (provided the word select signal is switched on). mute mode is activated when the wo rd select signal is switched off. the left or right channel is selected by applyin g the word select signal to, respectively, the wsl or the wsr terminal. the word select terminal not connected should be connected to v ddp or to pcb ground. this simp lifies the connection to the v ddp terminal in the wlcsp9 package. when the word select signal is connected to both terminals, the tfa9882 amplifies the sum of both channels divided by two. table 4. mode selection mode channel frequency on bck frequency on wsl frequency on wsr outa, outb power-down 0 hz don?t care don?t care floating mute 2.048 mhz to 3.072 mhz 0 hz 0 hz floating operating left 2.048 mhz to 3.072 mhz 32 khz to 48 khz 0 hz switching right 2.048 mhz to 3.072 mhz 0 hz 32 khz to 48 khz switching (left + right) / 2 2.048 mhz to 3.072 mhz 32 khz to 48 khz 32 khz to 48 khz switching
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 6 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 8.2 i 2 s format the tfa9882 supports the philips i 2 s standard with a bck frequency 64 times greater than the sampling rate (64fs). the bit length can be from 8 to 32 bits. supported i 2 s sample rates are listed in ta b l e 5 while figure 5 illustrates the i 2 s data transfer format. 8.3 power-up/power-down sequence the tfa9882 power-up/power-down sequence is shown in figure 6. external power supplies v ddp and v ddd should be within their operating limits before the tfa9882 switches to operating mode. the tfa9882 should be switched to power-down mode before the power supplies are disconnected or turned off. table 5. supported i 2 s sample rates f s (khz) ws (khz) bck, 64f s (mhz) 32 32 2.048 44.1 44.1 2.8224 48 48 3.072 msb = most significant bit; b2 = second most significant bit fig 5. i 2 s format msb msb b2 2 1 12 3 left i 2 s-bus format ws bck data right 3 msb b2 010aaa728 fig 6. power-up/power-down timing (without control settings) t d(on) operating mute operating t d(off) switching floating switching 64f s clock signal 1f s clock signal no clock signal 1f s clock signal v ddd , v ddp bck outa , outb ws 010aaa729
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 7 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier [1] r l = load resistance; l l = load inductance. [2] inversely proportional to f s . 8.4 control settings if the device can operate effectively with th e default settings, the control settings don?t need to be changed. 8.4.1 control setting pattern recognition the tfa9882 can detect control settings via the i 2 s input. control settings are selected by transmitting control patterns on the data input during the power-up sequence (the first 12288 bit clock cycles). the word select si gnal (ws) must be switched off during this interval. figure 7 illustrates the control setting sequen ce. after receiving 128 consecutive control setting bytes, the tfa9882 activates the appropriate control setting (see the third column of ta b l e 7 ). control settings remain unchanged in all modes unless control pattern 0xaa is received or the v ddd supply voltage is removed. [1] the related bytes are the bytes from the first column phase shifted by 1, 2, 3, 4, 5, 6 and 7 bits. table 6. power-up/power-down timing all parameters are guaranteed for v ddp = 3.6 v; v ddd = 1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit t d(on) turn-on delay time [2] --4ms t d(off) turn-off delay time [2] --5 s lsb = least significant bit; msb = most signific ant bit; b2 = second most significant bit fig 7. power-up/power-down timing (without control settings) ws 3 2 1 bck msb b2 data msb lsb b2 msb lsb b2 msb lsb b2 lsb power-down 12288 control settings i 2 s data 010aaa731 t d(on) table 7. control settings byte related bytes [1] control settings 0xd2 0x69/b4/5a/2d/96/4b/a5 clip control on; see section 8.4.2 0xd4 0x6a/35/9a/4d/a6/53/a9 gain = ? 3 db (v ddp = 2.5 v); see section 8.4.3 0xd8 0x6c/36/1b/8d/c6/63/b1 gain = +3 db (v ddp = 5.0 v); see section 8.4.3 0xe1 0xf0/78/3c/1e/0f/87/ c3 slope low (emc); see section 8.4.4 0xe2 0x71/b8/5c/2e/17/8b/ c5 dynamic power stage activation (dpsa) off; see section 8.4.5 0xaa 0x55 default; no mute, reset settings to default
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 8 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 8.4.2 clip control tfa9882 clip control is off by default. clip control can be turned on via control setting 0xd2 (see section 8.4.1 ). the tfa9882 clips smoothly with clip control on. output power is at maximum with clip control off. 8.4.3 gain selection signal conversion from digital audio to pw m modulated audio out is independent of supply voltages v ddp and v ddd . at the default gain setting (0 db), the audio output signal level is just below the clipping poin t at a supply voltage of 3.6 v at ? 6 dbfs (peak) input. the tfa9882 supports two further gain settings to support full output power at v ddp = 2.5 v and v ddp = 5.0 v. the gain settings can be selected via control settings 0xd4 and 0xd8 (see section 8.4.1 ). ta b l e 8 details the corresponding peak output voltage level at ? 6 dbfs for the three gain settings. [1] r l = load resistance; l l = load inductance. 8.4.4 pwm slope selection the rise and fall times of the pwm output edges can be set to one of two values, as detailed in table 9 . the default setting is ?slope normal? (10 ns with v ddp = 3.6 v). ?slope low? is selected via control setting 0xe1 (see section 8.4.1 ). this function is implemented to reduce electromagne tic interference (emi). 8.4.5 dynamic power stage activation (dpsa) the tfa9882 uses dpsa to regulate current consumption in line with the level of the incoming audio stream. this function switch es off power stage sections that are not needed, reducing current consumption. each of the tfa9882 h-bridge power stages is divided into eight sections. the number of power stage sections activated depends on the level of the incoming audio stream. the thresholds used by the dpsa to determine how many stages are switched on are given in ta b l e 1 0 . the dpsa signal is used as a refer ence signal for swit ching power stage sections on and off. the dpsa signal will rise in tandem with the rectified audio input signal. when the rectif ied audio input signal falls, the dpsa decreases with a negative exponential function , as illustrated in figure 8 . table 8. output voltage all parameters are guaranteed for v ddp = 3.6 v; v ddd =1.8 v; r l = 4 [1] , l l =20 h [1] , f i = 1 khz, f s = 48 khz, t amb = 25 c, default settings; unless otherwise specified. symbol parameter conditions min typ max unit v om peak output voltage at ? 6 dbfs (peak) digital input gain = ? 3db, v ddp = 2.5 v, r l = 4 [1] -2.4-v gain = 0 db, v ddp = 3.6 v, r l = 4 ; default [1] -3.4-v gain = +3 db, v ddp = 5.0 v, r l = 8 [1] -4.7-v table 9. slope rise and fall times setting rise and fall times of the pwm output edges slope low 40 ns with v ddp = 3.6 v slope normal; default setting 10 ns with v ddp = 3.6 v
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 9 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier the dpsa function can be switched off via contro l setting 0xe2 (see section 8.4.1 ). when dpsa is off, all power st age sections are activa ted in operating mode. 8.5 high-pass filter the high-pass filter blocks the dc components in the incoming audio stream. the cut-off frequency, f high( ? 3db) , is determined by the sampling frequency, f s , and is defined in equation 1 : (1) f high( ? 3db) is about 1.9 hz at a sampling frequency of 48 khz. the high-pass filter is always enabled. 8.6 pwm frequency the tfa9882 translates the i 2 s input stream into an amplified 3-level pwm output signal. the pwm switching frequency is linearly propor tional to the sampling frequency, and is defined in equation 2 . (2) the pwm switching frequency equals 384 kh z when the sampling frequency is 48 khz. table 10. dpsa input levels setting number of power stage sections active 0.035 full scale ( ? 29 dbfs) 1 > 0.035 full scale ( ? 29 dbfs) 2 > 0.07 full scale ( ? 23 dbfs) 4 > 0.105 full scale ( ? 19.5 dbfs) 8 fig 8. dynamic power stage activation 8 sections 4 sections dpsa signal 2 sections 010aaa71 3 1 section 0.105 full scale 0.07 full scale 0.035 full scale f high 3db ? () f s ? 4095 4096 ? () ln ? 2 ? ------------------------------------------------- = f sw pwm () 8f s ? =
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 10 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 8.7 bandwidth the tfa9882 output spectrum has a sigma-delta converter characteristic. figure 9 illustrates the output power spectrum of the tfa9882 when it is receiving an i 2 s input stream without audio content. the quantizat ion noise is shaped above the band of interest. the band of interest (bandwidth) is determined by the high corner frequency where the noise is increasing. the bandwidth in figure 9 scales with the sampling frequency and is defined in equation 3 : (3) 8.8 protection mechanisms the following protection circuits are included in the tfa9882: ? overtemperature protection (otp) ? overvoltage protection (ovp) ? undervoltage protection (uvp) ? overcurrent protection (ocp) the reaction of the device to fault conditio ns differs depending on the protection circuit involved. 8.8.1 overtemperature protection (otp) otp prevents heat damage to the tfa9882. it is triggered when the junction temperature exceeds t act(th_prot) . when this happens, the output stages are set floating. otp is cleared automatically via an internal ti mer (200 ms), after which t he output stages will start to operate normally again. fig 9. output power spectrum, f s = 48 khz bw 0.4535 f s ? = 010aaa709 ? 120 ? 80 ? 40 output (dbfs) ? 160 f (hz) 10 10 6 10 5 10 2 10 4 10 3
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 11 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 8.8.2 supply voltage protection mechanisms (uvp and ovp) uvp is activated, setting the outputs floating, if the supply voltage drops below the undervoltage protection threshold, v p(uvp) . this transition will be silent, without pop noise. when the supply voltage rises above v p(uvp) again, the system will be restarted after 200 ms. ovp is activated, setting the power stages floating, if the supply voltage rises above the overvoltage protection threshold, v p(ovp) . the power stages are re-enabled as soon as the supply voltage drops below v p(ovp) again. the system will be restarted after 200 ms. 8.8.3 overcurrent protection (ocp) ocp will detect a short circuit across the load or between one of the amplifier outputs and one of the supply lines. if the output curren t exceeds the overcurrent protection threshold (i o(ocp) ), it will be limited to i o(ocp) while the amplifier outputs ar e switching (the amplifier is not powered down completely). this is called current limiting. the amplifier can distinguish between an impedance drop at th e loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. the impedance threshold depends on which supply voltage is being used: ? in the event of a short circuit across the load or a short to one of the supply lines, the audio amplifier is switched of f completely. it will tr y to restart again after approximately 200 ms. if the short-circuit condition is still present after this time, this cycle will be repeated. average di ssipation will be low because of the short duty cycle. ? in the event of an impedance drop (e.g. du e to dynamic behavior of the loudspeaker), the same protection mechanism will be acti vated. the maximum output current is again limited to i o(ocp) , but the amplifier will no t switch off completely (thus preventing audio holes from occurring). th is will result in a clipped out put signal without artifacts.
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 12 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 9. internal circuitry 10. limiting values table 11. internal circuitry pin symbol equivalent circuit a1 data c1 bck b1 v ddd b2 v ddp a2 wsl c2 wsr a3 outb c3 outa 010aaa71 4 esd b3 a1, c1 010aaa71 5 b3 b1, b2 esd 010aaa71 6 b3 b2 a2, c2 esd 010aaa717 b3 b2 a3, c3 table 12. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v ddp power supply voltage on pin v ddp ? 0.3 +5.5 v v ddd digital supply voltage on pin v ddd ? 0.3 +1.95 v t j junction temperature - +150 c t stg storage temperature ? 55 +150 c t amb ambient temperature ? 40 +85 c v x voltage on pin x pins bck and data ? 0.3 +3.6 v pins outa and outb ? 0.6 v ddp + 0.6 v pins wsl and wsr ? 0.6 v ddp v
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 13 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier [1] measurements taken on the tfa9882 in a hvson10 package (enginee ring samples) due to handling restrictions with wlcsp9. 11. thermal characteristics [1] measured on a jedec high k-factor test board (standard eia/jesd 51-7). [2] value depends on where measurement is taken on package. 12. characteristics 12.1 dc characteristics v esd electrostatic discharge voltage according to the human body model (hbm) [1] pins outa and outb ? 8+8 kv any other pin ? 2+2 kv according to the charge device model (cdm) [1] ? 500 +500 v according to the machine model (mm) [1] ? 200 +200 v table 12. limiting values ?continued in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit table 13. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; natural convection jedec test board [1] 128 k/w 2-layer application board 97 k/w j-top thermal characterization parameter from junction to top of package [2] 12 k/w table 14. dc characteristics all parameters are guaranteed for v ddp = 3.6 v; v ddd =1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c, default slope and gain settings; unless otherwise specified. symbol parameter conditions min typ max unit v ddp power supply voltage on pin v ddp 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i ddp power supply current operating mode with load f s = 48 khz - 1.5 1.7 ma f s = 32 khz - 1.38 - ma mute mode 1.1 1.25 ma power-down mode - 0.1 1 a
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 14 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier [1] r l = load resistance; l l = load inductance. i ddd digital supply current operating mode f s = 48 khz - 1.25 1.4 ma f s = 32 khz - 0.85 - ma mute mode f s = 48 khz - 1.1 1.2 ma f s = 32 khz - 0.8 - ma power-down mode bck = ws = data = 0 v -2.510 a series resistance output power switches r dson drain-source on-state resistance - 125 150 m amplifier output pins; pins outa and outb | v o(offset) | output offset voltage - - 3 mv bck, data, wsl and wsr v ih high-level input voltage 0.7v ddd -3.6v v il low-level input voltage - - 0.3v ddd v c i input capacitance - - 3 pf protection t act(th_prot) thermal protection activation temperature 130 - 150 c v p(ovp) overvoltage protection supply voltage 5.5 - 6.0 v v p(uvp) undervoltage protection supply voltage 2.3 - 2.5 v i o(ocp) overcurrent protection output current 1.45 - - a table 14. dc characteristics ?continued all parameters are guaranteed for v ddp = 3.6 v; v ddd =1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c, default slope and gain settings; unless otherwise specified. symbol parameter conditions min typ max unit
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 15 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 12.2 ac characteristics [1] r l = load resistance; l l = load inductance. [2] inversely proportional to f s . table 15. ac characteristics all parameters are guaranteed for v ddp = 3.6 v; v ddd =1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c, default slope and gain settings; unless otherwise specified. symbol parameter conditions min typ max unit output power p o(rms) rms output power thd + n = 1 % v ddp = 3.6 v, f i = 100 hz - 1.4 - w v ddp = 5.0 v, f i = 100 hz - 2.7 - w thd + n = 1 %; r l = 8 ; l l = 44 h v ddp = 3.6 v, f i = 100 hz - 0.75 - w v ddp = 5.0 v, f i = 100 hz - 1.45 - w thd + n = 10 % v ddp = 3.6 v, f i = 100 hz - 1.75 - w v ddp = 5.0 v, f i = 100 hz - 3.4 - w thd + n = 10 %; r l = 8 ; l l = 44 h v ddp = 3.6 v, f i = 100 hz - 0.95 - w v ddp = 5.0 v, f i = 100 hz - 1.85 - w performance po output power efficiency p o(rms) = 1.4 w - 90 - % thd+n total harmonic distortion-plus-noise p o(rms) = 100 mw - 0.02 0.1 % v n(o) output noise voltage a-weighted - 24 - v s/n signal-to-noise ratio v ddp =5 v; v o = 3.4 v (rms); a-weighted - 103 - db psrr power supply rejection ratio v ripple =200 mv; f ripple = 217 hz - 85 - db v om peak output voltage at ? 6 dbfs (peak) digital input: gain = ? 3 db; v ddp = 2.5 v - 2.3 - v gain = 0 db; v ddp = 3.6 v 3.1 3.3 3.5 v gain = +3 db; v ddp = 5.0 v; r l =8 -4.7- v power-up, power-down and propagation times t d(on) turn-on delay time [2] -- 4ms t d(off) turn-off delay time [2] -- 5 s t pd propagation delay [2] -600- s
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 16 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 12.3 i 2 s timing characteristics [1] r l = load resistance; l l = load inductance. table 16. i 2 s timing characteristics all parameters are guaranteed for v ddp = 3.6 v; v ddd =1.8 v; r l = 4 [1] ; l l = 20 h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 c, default slope and gain settings; unless otherwise specified. symbol parameter conditions min typ max unit f s sampling frequency on pins wsl or wsr 32 - 48 khz f clk clock frequency on pin bck - 64f s -hz t su set-up time ws edge to bck high 10 - - ns data edge to bck high 10 - - ns t h hold time bck high to ws edge 10 - - ns bck high to data edge 10 - - ns fig 10. i 2 s timing bck ws data t h t su 010aaa732
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 17 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 13. application information 13.1 electromagnetic co mpatibility (emc) emc standards define to what degree a (sub)syst em is susceptible to externally imposed electromagnetic influences and to what degree a (sub)system is responsible for emitting electromagnetic signals, when in standby mode or operating mode. emc immunity and emission values are norma lly measured over a frequency range from 180 khz up to 3 ghz. 13.1.1 immunity a major reason why amplifier devices pick up high frequency signals, and (after detection) manifest these in the device's audio band, is the presence of analog circuits inside the device or in the (sub)system. the tfa9882 has digital inputs and digital outputs. comparative tests on a tfa9882-based (sub)system show that the impa ct of externally imposed electromagnetic signals on the device is negligible in both standby and operating modes. 13.1.2 emissions since the tfa9882 is a class-d amplifier with digitally switched outputs in a btl configuration, it can potent ially generate emissions due to the steep edges on the amplifier outputs. external components can be used to suppress these emissions. however, the tfa9882 features built-in slop e control to suppress such emissions by reducing the slew rate of the btl output sig nals. by reducing the slew rate, the emissions are reduced by some 10 db when compared with full-speed operation. 13.2 supply decoupling and filtering a ceramic decoupling capacitor of between 4.7 f and 10 f should be placed close to the tfa9882 for decoupling the v ddp supply. this minimizes the size of the high-frequency current loop, thereby optimizing emc performance.
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 18 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 13.3 typical application diagram (simplified) fig 11. typical stereo application (simplified) TFA9882UK data bck 010aaa733 a1 c1 v ddd b1 baseband processor i 2 s output 1.8 v cvddd 100 nf battery cvddp 4.7 f outa outb a3 c3 left speaker 4 or 8 gnd b3 wsl a2 wsr c2 v ddp b2 TFA9882UK data bck a1 c1 v ddd b1 1.8 v cvddd 100 nf battery cvddp 4.7 f outa outb a3 c3 right speaker 4 or 8 gnd b3 wsl a2 wsr c2 v ddp b2
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 19 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 13.4 curves measured in referen ce design (demonstration board) all measurements were taken with v ddd =1.8v, f clk = 6.144 mhz, clip control off, dpsa off and slope normal, unless otherwise specified. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. a. v ddp =3.6v,r l =8 , l l = 44 hb.v ddp =5v,r l =8 , l l = 44 h (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. (1) f i = 6 khz. (2) f i = 1 khz. (3) f i = 100 hz. c. v ddp =3.6v,r l =4 , l l = 20 hd.v ddp =5v,r l =4 , l l = 20 h fig 12. thd+n as a function of output power 001aam634 10 ? 1 10 ? 2 10 1 10 2 thd+n (%) 10 ? 3 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (2) (3) 001aam636 10 ? 1 10 ? 2 10 1 10 2 thd+n (%) 10 ? 3 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (3) (2) 001aam633 10 ? 1 10 ? 2 10 1 10 2 thd+n (%) 10 ? 3 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (2) (3) 001aam635 10 ? 1 10 ? 2 10 1 10 2 thd+n (%) 10 ? 3 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (3) (2)
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 20 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier (1) p o = 500 mw (2) p o = 100 mw (1) p o = 500 mw (2) p o = 100 mw a. v ddp =3.6v,r l =8 , l l = 44 hb.v ddp =5v,r l =8 , l l = 44 h (1) p o = 1w (2) p o = 100 mw (1) p o = 1w (2) p o = 100 mw c. v ddp =3.6v,r l =4 , l l = 20 hd.v ddp =5v,r l =4 , l l = 20 h fig 13. thd+n as a function of frequency 001aam638 f i (hz) 10 10 5 10 4 10 2 10 3 10 ? 2 10 ? 1 1 10 thd+n (%) 10 ? 3 (1) (2) 001aam640 f i (hz) 10 10 5 10 4 10 2 10 3 10 ? 2 10 ? 1 1 10 thd+n (%) 10 ? 3 (1) (2) 001aam637 f i (hz) 10 10 5 10 4 10 2 10 3 10 ? 2 10 ? 1 1 10 thd+n (%) 10 ? 3 (1) (2) 001aam639 f i (hz) 10 10 5 10 4 10 2 10 3 10 ? 2 10 ? 1 1 10 thd+n (%) 10 ? 3 (1) (2)
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 21 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier (1) v ripple = 0 v (f ripple = 0 hz) (2) f ripple = 217 hz (3) f ripple = 1 khz (4) f ripple = 6 khz (1) v ripple = 0 v (f ripple = 0 hz) (2) f ripple = 217 hz (3) f ripple = 1 khz (4) f ripple = 6 khz a. v ddp =3.6v,r l =4 , l l = 20 h, p o = 100 mw v ripple = 200 mv (rms) b. v ddp =5v,r l =4 , l l = 20 h, p o =100 mw v ripple = 200 mv (rms) fig 14. thd+n + power supply intermodulation distortion as a function of frequency 001aam641 f i (hz) 10 10 5 10 4 10 2 10 3 (4) (3) (2) (1) 10 ? 2 10 ? 1 1 10 thd+n+imd (%) 10 ? 3 001aam642 f i (hz) 10 10 5 10 4 10 2 10 3 (4) (3) (2) (1) 10 ? 2 10 ? 1 1 10 10 ? 3 thd+n+imd (%) (1) gain = +3 db (2) gain = 0 db (3) gain = ? 3 db v ddp = 3.6 v, r l =4 , l l = 20 h, p o = 500 mw (1) v ddp = 3.6 v (2) v ddp = 5 v r l =4 , l l = 20 h, v ripple = 200 mv (rms) fig 15. normalized gain as a function of frequency fig 16. psrr as a function of ripple frequency 001aan660 f i (hz) 10 10 5 10 4 10 2 10 3 0 -2 2 4 g (db) -4 (1) (3) (2) 001aam644 ? 70 ? 50 ? 90 ? 30 ? 10 psrr (db) ? 110 f ripple (hz) 10 10 5 10 4 10 2 10 3 (2) (1)
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 22 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier (1) a-weighted (2) 20 khz brickwall filter v ddp =5v, r l =4 , l l =20 h, reference signal: 3.4 v (rms) fig 17. s/n ratio as a function of output power 001aam632 50 70 30 90 110 s/n ratio (db) 10 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (2) (1) thd+n = 10 %, r l =4 , l l = 20 h (2) thd+n = 1 %, r l =4 , l l = 20 h (3) thd+n = 10 %, r l =8 , l l = 44 h (4) thd+n = 1 %, r l =8 , l l = 44 h (1) thd+n = 10 %, r l =4 , l l = 20 h (2) thd+n = 1 %, r l =4 , l l = 20 h (3) thd+n = 10 %, r l =8 , l l = 44 h (4) thd+n = 1 %, r l =8 , l l = 44 h a. f i = 100 hz, clip control off b. f i = 100 hz, clip control on fig 18. output power as a function of supply voltage v ddp (v) 26 5 34 001aam649 2 3 1 4 5 p o (w) 0 (1) (2) (3) (4) v ddp (v) 26 5 34 001aam650 2 1 3 4 p o (w) 0 (1) (2) (3) (4)
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 23 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier (1) v ddp =3.6v (2) v ddp =5v (1) v ddp =3.6v (2) v ddp =5v a. r l =8 , l l =44 h, f i = 1 khz, dpsa on b. r l =4 , l l =20 h, f i = 1 khz, dpsa on fig 19. power dissipation as a function of output power 001aam647 0.05 0.10 0.15 p (w) 0 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (2) 001aam645 0.2 0.1 0.3 0.4 p (w) 0 p o (w) 10 ? 3 10 1 10 ? 2 10 ? 1 (1) (2) (1) v ddp =3.6v (2) v ddp =5v (1) v ddp =3.6v (2) v ddp =5v a. r l =8 , l l =44 h, f i = 1 khz, dpsa on b. r l =4 , l l =20 h, f i = 1 khz, dpsa on fig 20. efficiency as a function of output power p o (w) 0 2.0 1.5 0.5 1.0 001aam648 40 60 20 80 100 (%) 0 (1) (2) p o (w) 0 3.5 3.0 1.0 2.0 0.5 1.5 2.5 001aam646 40 60 20 80 100 (%) 0 (1) (2)
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 24 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 14. package outline fig 21. package outline TFA9882UK (wlcsp9) references outline version european projection issue date iec jedec jeita TFA9882UK TFA9882UK_po 11-02-01 11-02-10 unit mm max nom min 0.6 0.22 0.20 0.18 0.28 0.26 0.24 1.521 1.491 1.461 1.301 1.271 1.241 0.4 0.8 0.015 0.02 a dimensions wlcsp9: wafer level chip-size package; 9 bumps; body 1.49 x 1.27 mm TFA9882UK a 1 a 2 0.38 0.36 0.34 bdeee 1 0.8 e 2 vw 0.04 yz d1 0.465 0.435 0.405 z d2 0.285 0.255 0.225 z e 0.265 0.235 0.205 0 0.5 1 mm scale c y x b a bump a1 index area d e detail x a a 2 a 1 c z d2 z d1 b e 1 e 1 e e bump a1 index area b 123 a a c b ? v c ? w
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 25 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 15. soldering of wlcsp packages 15.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 15.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 15.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 22 ) than a pbsn process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 1 7 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 22 . table 17. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 26 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 15.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 15.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 15.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 22. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 27 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 15.3.4 cleaning cleaning can be done after reflow soldering.
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 28 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 16. revision history table 18. revision history document id release date data sheet status change notice supersedes tfa9882 v.2 20110420 product data sheet tfa9882 v.1 modifications: ? data sheet status changed to ?product data sheet? tfa9882 v.1 20110331 preliminary data sheet - -
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 29 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 17.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 17.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? 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applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
tfa9882 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 2 ? 20 april 2011 30 of 31 nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 17.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 18. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors tfa9882 3.4 w i2s input mono class-d audio amplifier ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 20 april 2011 document identifier: tfa9882 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 mode selection and interfacin g . . . . . . . . . . . . . 5 8.2 i 2 s format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3 power-up/power-down sequence . . . . . . . . . . . 6 8.4 control settings. . . . . . . . . . . . . . . . . . . . . . . . . 7 8.4.1 control setting pattern recognition . . . . . . . . . . 7 8.4.2 clip control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.4.3 gain selection . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.4.4 pwm slope selection . . . . . . . . . . . . . . . . . . . . 8 8.4.5 dynamic power stage ac tivation (dpsa). . . . . 8 8.5 high-pass filter . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.6 pwm frequency . . . . . . . . . . . . . . . . . . . . . . . . 9 8.7 bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.8 protection mechanisms . . . . . . . . . . . . . . . . . 10 8.8.1 overtemperature protecti on (otp) . . . . . . . . 10 8.8.2 supply voltage protection mechanisms (uvp and ovp) . . . . . . . . . . . . . . . . . . . . . . . 11 8.8.3 overcurrent protection (ocp) . . . . . . . . . . . . 11 9 internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12 10 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12 11 thermal characteristics . . . . . . . . . . . . . . . . . 13 12 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . 13 12.2 ac characteristics. . . . . . . . . . . . . . . . . . . . . . 15 12.3 i 2 s timing characteristics . . . . . . . . . . . . . . . . 16 13 application information. . . . . . . . . . . . . . . . . . 17 13.1 electromagnetic compatibility (emc) . . . . . . . 17 13.1.1 immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.1.2 emissions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13.2 supply decoupling and filtering. . . . . . . . . . . . 17 13.3 typical application diagram (simplified) . . . . . 18 13.4 curves measured in reference design (demonstration board) . . . . . . . . . . . . . . . . . . 19 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 24 15 soldering of wlcsp packages. . . . . . . . . . . . 25 15.1 introduction to soldering wlcsp packages . . 25 15.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 25 15.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . 25 15.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 15.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 26 15.3.3 rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 15.3.4 cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 16 revision history . . . . . . . . . . . . . . . . . . . . . . . 28 17 legal information . . . . . . . . . . . . . . . . . . . . . . 29 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 29 17.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 30 18 contact information . . . . . . . . . . . . . . . . . . . . 30 19 contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

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